POWER SEMICONDUCTOR MODULE

摘要

PURPOSE: A power semiconductor module is provided to obviate the necessity of an insulation substrate having a pattern, by using an insulated wire having a socket to form an external input control terminal without a soldering process. CONSTITUTION: A heat compensation plate is connected to an end of an electrode terminal. The heat compensation plate is connected to an end of an electrode terminal. A gate electrode connecting member is vertically connected to the heat compensation plate so that an electrical signal of a semiconductor chip can be transferred. A plurality of sockets are coupled to an upper part of the gate electrode connecting member so that an electrical signal can be transferred to the exterior. A wire is connected to the plurality of sockets and the electrode terminal to make four control terminals disposed at regular intervals so that an electrical signal can mutually be transferred.