发明名称 MOISTURE-CURABLE URETHANE-BASES HOT MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable urethane-based hot melt adhesive which has a sufficient long adherable time after thermally melted and coated, has excellent workability, and expresses excellent strength, heat resistance, elasticity or the like, after cured with moisture. SOLUTION: This moisture-curable urethane-based hot melt adhesive contains, as a main component, a urethane prepolymer which is solid at the ordinary temperature, has isocyanate groups at both the molecular terminals, and is obtained by reacting a polyisocyanate compound with a hydroxyl group- containing composition comprising 30 to 90 wt.% of a polyester resin having hydroxyl groups at both the molecular terminals and 10 to 70 wt.% of a polyalkylene glycol that has hydroxyl groups at both the molecular terminals and at least one 2, 2'-bisphenylpropane skeleton in the main molecular chain. The moisture-curable urethane-based hot melt adhesive is characterized in that the softening pint (ring and ball method) measured according to JIS K-2207 is <=60 deg.C before cured with moisture.
申请公布号 JP2001262112(A) 申请公布日期 2001.09.26
申请号 JP20000082488 申请日期 2000.03.23
申请人 SEKISUI CHEM CO LTD 发明人 TANAKA YUKIO
分类号 C09J175/04;(IPC1-7):C09J175/04 主分类号 C09J175/04
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