| 发明名称 |
PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME AND CAPACITOR TO BE CONTAINED IN PRINTED WIRING BOARD |
| 摘要 |
Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large. <IMAGE> |
| 申请公布号 |
EP1137332(A1) |
申请公布日期 |
2001.09.26 |
| 申请号 |
EP20000956889 |
申请日期 |
2000.09.01 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
INAGAKI, YASUSHI;ASAI, MOTOO;WANG, DONGDONG;YABASHI, HIDEO;SHIRAI, SEIJI |
| 分类号 |
H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K1/18;H05K3/46 |
主分类号 |
H01L21/48 |
| 代理机构 |
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