发明名称 FLAT PLATE TYPE ELECTRIC PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flat plate type electric plating apparatus to implement the electric plating on a flat printed circuit board supported by a frame in a plurality of chambers separated from each other in a basket. SOLUTION: The electric plating apparatus comprises the basket, a conductive frame, a plurality of electric plating chambers, and a cathode tool. The basket is connected to the conductive frame in a conductive manner, the electric plating chambers are slender and arrayed in the basket parallel to each other, an insulation seat to insert the printed circuit board is provided on both sides of the electric plating chamber, and a steel plate is provided as an anode. The area of the steel plate is the same as the corresponding area of the printed circuit board, and the steel plate and the printed circuit board are separated from each other by the insulation seat. The cathode tool is disposed above the basket, and connected to the printed circuit board inside the electric plating chambers in a conductive manner, and the steel plate the printed circuit board are formed to be the anode and the cathode of the electric plating apparatus, respectively.
申请公布号 JP2001262398(A) 申请公布日期 2001.09.26
申请号 JP20000079986 申请日期 2000.03.22
申请人 WUS PRINTED CIRCUIT CO LTD;EUGEN BREITKREUTZ 发明人 CHIN KINSHO;EUGEN BREITKREUTZ
分类号 C25D7/00;C25D17/08;H05K3/18;(IPC1-7):C25D17/08 主分类号 C25D7/00
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