CURABLE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a curable resin composition which is substantially a solid at ordinary temperature and has a low viscosity and excellent moldability during thermal melting. SOLUTION: This swollen gel is capable of reducing the viscosity of the system by deswelling of a curable compound at a temperature or in a flow field or decrosslinking, etc., of an organic polymer during the thermal molding and is obtained by impregnating the organic polymer with the curable compound.