| 摘要 |
PROBLEM TO BE SOLVED: To perform cylindrical grinding of silicon mono-crystals without a drop of the yield by reducing local breaking stresses applied to the mono- crystals when multi-crystal silicon is melted followed by pulling-up of silicon mono-crystals and then the silicon mono-crystals are to be ground into the specified diameter. SOLUTION: A polyurethane sheet 13 is pinched to serve as a buffer material, and the end face 11 of mono-crystal and a pseodo-tail 12 are adhered together using polyepoxy bonding agent and fixed to a cylindrical grinding machine, and cylindrical grinding is performed. After finishing the cylindrical grinding, the polyurethane sheet 13 is torn off using a knife, etc., and the end face 11 of mono-crystal and the pseudo-tail 12 are separated from each other.
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