发明名称
摘要 A method of surface-mounting a connector on a circuit board using a rivet as a mounting member is provided. This method can provide an excellent assembling process by, if necessary, using the conventional solder dipping process or rivet caulking process. A rivet has a middle portion acting as a flange. In the rivet, one end is previously fixed to a connector side while the other end is inserted into a first hole formed in the surface of a circuit board, so that the flange can be closely attached to the circuit board. Particularly, since a soldering pad is formed adjacent to a hole formed in the circuit board, the rivet can be bonded to the circuit board while other electronic components are being surface-soldered on the circuit board.
申请公布号 JP3212938(B2) 申请公布日期 2001.09.25
申请号 JP19980065528 申请日期 1998.03.16
申请人 发明人
分类号 F16B5/04;F16B19/06;F16B19/08;H01R13/73;H05K1/18;(IPC1-7):H01R12/22;H01R12/04 主分类号 F16B5/04
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