| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package by which a semiconductor element housed inside a container can be operated normally and stably for a long period by a method wherein a part of a metallized layer, for connection, which connects a metallized wiring layer on an insulating board to a metallized metal layer is covered with an insulating layer. SOLUTION: An insulating base body 1 comprises a step-shaped recessed part 1a used to house a semiconductor element. A plurality of metallized wiring layers 5 are applied to the surface from the stepped part of the recessed part 1a. A frameshaped metallized metal layer 8 is applied to the surface around the recessed part 1a. Then, a part of a metallized layer 10, for connection, which connects the metallized wiring layers 5 to the metallized metal layer 8 is covered with an insulating layer 11. Thereby, a container 4 which is composed of the insulating substrate 1 and a lid body 2 is airtightly sealed completely, and the semiconductor element which is housed at the inside of the container 4 can be operated normally and stably for a long period. |
