| 摘要 |
PROBLEM TO BE SOLVED: To provide the above electrode which may be utilized for general solder joining enhanced in fixability by using for the electrode, and is adequate for lamination on the previous proposal of this applicant disclosed in Japanese Patent Publication No.58370 of 2000. SOLUTION: The electrode consists of 5.0 to 54.0 wt.% Sn, 46.0 to 50.0 wt.% Zn, 0.1 to 1.5 wt.% Cu and 0.05 to 0.50 wt.% Sb.
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