发明名称 CHIP MOLDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a compression molding device made by rolls of chips in large bulk, which is intertwined by winding and warping and generated in mechanical finishing. SOLUTION: A plurality of flanges 2 having a V-shaped notching 3 in the circumference is provided in the two rolls 1 arranged in parallel at appropriate intervals. Each of the flanges is arranged so as to fit between the flanges in the other side of the roll. These two rolls are rotated in a reverse direction each other, parts of the chips are taken in the roll by the V-shaped notching, and other parts of the chips intertwined with this are also taken therein together. These chips are compressed and molding in passing through between the two rolls. The chips between the flange and the roll are especially compressed hardly because of its narrow clearance, thereby, a formed material in a plate shape having high-strength is produced.</p>
申请公布号 JP2001259958(A) 申请公布日期 2001.09.25
申请号 JP20000080139 申请日期 2000.03.22
申请人 AKOTA:KK 发明人 TANAKA HIROKAZU
分类号 B23Q11/00;(IPC1-7):B23Q11/00 主分类号 B23Q11/00
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