| 摘要 |
PROBLEM TO BE SOLVED: To reduce the scratch density on the polishing surface in a polishing process. SOLUTION: The device for flattening a semiconductor device is provided with a dressing rate measuring device 11 for detecting the dressing rate of a polishing pad to be changed with the progress of polishing, and a surface shape measuring device 10 for measuring the surface state of the polishing pad. Torque for a polishing surface plate and driving torque for a dresser are found by converting values of current flowing to respective motors 7, 9 by an A/D converter 13, and the dressing condition is controlled by using the data automatically measured in real time so that the dressing rate having a serious effect on the scratch density may be within the range of a control specified value previously found and stored in a data base 15. |
