Apparatus and method for adapting surface mount solder pad for heat sink function

摘要

A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface that are adapted for soldering to leads of surface mount components. The solder pads are electrically interconnected by conductive traces also disposed on the surface. At least one of the solder pads has an enhanced surface area that is selected larger than necessary for the soldering, and that is selected sufficiently large so as to sink enough heat generated by one of the surface mount components to provide for its proper operation.