发明名称 |
REGENERATING METHOD FOR WAFER |
摘要 |
PROBLEM TO BE SOLVED: To suitably cope with the size enlargement of a wafer and to improve machining efficiency in polishing for regenerating the wafer. SOLUTION: In a regenerating method for a wafer, powder is sprayed to a surface of the wafer front surface on which a film is formed, and the film of the wafer is polished and removed.
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申请公布号 |
JP2001260025(A) |
申请公布日期 |
2001.09.25 |
申请号 |
JP20000076311 |
申请日期 |
2000.03.14 |
申请人 |
HITACHI LTD |
发明人 |
USHIFUSA NOBUYUKI;MORI TERUTAKA;NAKANO ASAO |
分类号 |
B24C1/00;B24C3/32;B24C11/00;(IPC1-7):B24C1/00 |
主分类号 |
B24C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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