| 摘要 |
A method and apparatus for laser diode bar assembly. A stacked array embodiment provides for efficient cooling of the diode bars and electrical connection between diode bars while maximizing alignment of the diode bars. The spacers are connected to a conductive surface on a heat spreader. In the stacked array, one or more diode bars are alternated in series with two or more conductive spacers, with a series circuit provided from diode bar to diode bar. The spacers hold the diodes spaced apart from insulating grooves in the conductive layer on the substrate. Alternatively, thermally conductive separator fins extend from the heat spreader substrate to contact the diode bars situated between the spacers to promote rapid heat transfer from the diodes while maintaining the diode bars electrically isolated from the conductive layer on the substrate.An apparatus and method are provided for assembling the stacked array assembly. A jig apparatus incorporates a tilted working surface upon which the diode bar/spacers subassembly is placed. Planar vertical walls extend up from the tilted working surface. The tilt to the working surface provides a gravity assist to the proper alignment of the diode bars and spacers against the vertical walls. A clamp squeezes the diode bars and spacers together and against one of the walls to foster optimized alignment and parallelism of the diode bars.A wedged array embodiment of the invention employs a specially grooved substrate. The diode bars are placed in the grooves, and customized wedges are then pressed into the grooves with the diodes therein, the wedges acting to push the diodes into proper parallel alignment in the grooves. Means for providing both series and parallel electrical circuits between diode bars are provided.
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