| 发明名称 |
Highly integrated chip-on-chip packaging |
| 摘要 |
The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry. |
| 申请公布号 |
US6294406(B1) |
申请公布日期 |
2001.09.25 |
| 申请号 |
US19990350274 |
申请日期 |
1999.07.06 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERTIN CLAUDE LOUIS;FERENCE THOMAS GEORGE;HOWELL WAYNE JOHN;SPROGIS EDMUND JURIS |
| 分类号 |
H01L25/18;H01L23/538;H01L25/065;H01L25/07;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L23/48;H01L23/52 |
主分类号 |
H01L25/18 |
| 代理机构 |
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| 主权项 |
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