发明名称 Reducing polymerization stress by controlled segmental curing
摘要 A photopolymerizable material is exposed to light to effect curing. A portion of the material is exposed to light in a conventional manner, while at least one other portion of the material is masked from direct exposure to the light by use of a mask (10) having at least one mask segment (11) which either completely or at least partially blocks the light. In this manner, the polymerization stress associated with the cured materials is limited or minimized due to extended molecular relaxation promoted by this controlled or hybrid curing technique. Also according to the invention, different segments (30, 31) of a material to be cured (22) are exposed to different wavelengths of light energy (21) or one such segment (30, 31) is exposed to light energy while another such segment is not.
申请公布号 AU4574701(A) 申请公布日期 2001.09.24
申请号 AU20010045747 申请日期 2001.03.15
申请人 DENTSPLY INTERNATIONAL INC. 发明人 PAUL D. HAMMESFAHR;XIAOMING JIN
分类号 A61C13/15;A61C19/00;A61K6/00;B29C35/08;G02B6/04;G02B6/42 主分类号 A61C13/15
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