发明名称 |
Processes and apparatus for treating electronic components |
摘要 |
A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided. |
申请公布号 |
AU4566401(A) |
申请公布日期 |
2001.09.24 |
申请号 |
AU20010045664 |
申请日期 |
2001.03.13 |
申请人 |
CFMT, INC. |
发明人 |
STEVEN VERHAVERBEKE;LEWIS LIU;ALAN E WALTER;C. WADE SHEEN;CHRISTOPHER F MCCONNELL |
分类号 |
B08B3/08;B08B3/04;B08B3/10;G03F7/42;H01L21/00;H01L21/027;H01L21/304 |
主分类号 |
B08B3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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