发明名称 METHOD OF DETECTING HEIGHT OF PRIMARY JET SOLDER IN JET SOLDERING, AND PRINTED WIRING BOARD HAVING DETECTION MEANS
摘要 PROBLEM TO BE SOLVED: To accurately detect the height of primary jet solder without dropping the productivity of a line for proper soldering. SOLUTION: The inside of a printed wiring board or a sacrificial board is provided with a plurality of holes of different sizes, and the height is judged by detecting the condition of jet solder which contacts the downside of the printed wiring board through these holes when soldering by bringing the downside of the printed wiring board, where electronic parts are mounted temporarily, into contact with primary jet solder 4a and secondary jet solder 4b. Accordingly, since the operator can directly detect it during soldering process in this method, he can adjust it without interrupting the process so that it may be always in proper contact condition, so he can sharply suppress the occurrence of inferior goods, too, without dropping the productivity.
申请公布号 JP2001257463(A) 申请公布日期 2001.09.21
申请号 JP20000066469 申请日期 2000.03.10
申请人 SONY CORP 发明人 ITO KAZUHIRO
分类号 B23K1/00;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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