| 摘要 |
PROBLEM TO BE SOLVED: To enhance positioning accuracy and keep strength of soldering with solder cream in positioning and mounting an electronic component to a printed board. SOLUTION: On a solder pad 5, a pad groove 6 is so formed as to fringe the part to which end sides of a lead wire 2 touch when the lead wire 2 of a connector member is positioned. The pad groove 6 formed along the sides and apex parts of each lead wire 2 suppresses movement of the lead wire 2 and prevents slippage of its position when solder cream is coated and melted for fixing.
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