| 摘要 |
PROBLEM TO BE SOLVED: To shorten soldering time, to uniformize the thickness of a solder layer and to prepare optimal temperature profile, when producing a thermoelectric element. SOLUTION: This method is provided with a process P1 for coating an upper electrode and a lower electrode with solder, process P2 for positioning the thermoelectric semiconductor element, the upper electrode and lower electrode coated with solder in the process P1 on a soldering jig, process P3 for pressing and heating them from the upside of the upper electrode and the downside of the lower electrode positioned in the process P2 with a fixed pressure, process P4 for quickly cooling them from the upside of the upper electrode and the downside of the lower electrode, while pressing them with the fixed pressure, and process P5 for detaching the soldered thermoelectric semiconductor device and the upper and lower electrodes from the soldering jig by removing the fixed pressure.
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