| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, with which a CSP having no built-in interposer can be made into a MCP, and also to provide methods of manufacturing and testing the same. SOLUTION: A plurality of IC chips are housed in one package and a size of the largest IC chip 101 is a package size. On the IC chip 101, pads 102 electrically connected to an internal IC of the IC chip 101 and two layers of protective films 103, 104 having openings on the pads 102 are installed. In order to secure connection to the outside of the package from the pads 102, conductors 105, 106 and a connection material 107 are provided. On the surface protective film 104, another IC chip 111 is die-bonded by a die-bonding material 108. Likewise, die pads 112, surface protective films 113, 114, conductors 115, 116 and a connection material 117 are installed on the IC chip 111.</p> |
