发明名称 ELECTRIC CONNECTION STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To obtain a good state of soldering by preventing overflow of soldering material. SOLUTION: With respect to a structure in which terminals 13a and 13b of each side of the electronic component 13 are soldered to conductors 11 and 12 while the electronic component 13 is laid across the conductors 11 and 12 of both sides, weirs 15 for stopping the overflow of soldering material 14 out of the soldering region are protruded in U shape on the soldering surface of the conductors 11 and 12 of both sides in such a way that they surround the soldering region.
申请公布号 JP2001257444(A) 申请公布日期 2001.09.21
申请号 JP20000064485 申请日期 2000.03.09
申请人 AUTO NETWORK GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD 发明人 SAKA YOSHIFUMI
分类号 H01R4/02;H01L23/48;H05K1/18;(IPC1-7):H05K1/18 主分类号 H01R4/02
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