| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which can be industrially easily manufactured at a low cost and by which a stand-off structure flexibly adaptable to various kinds of modules can be ensured. SOLUTION: Before a module 2 is stand-off mounted on a mother circuit board 1, first protrusions 12 are formed by applying a metal part 121 such as copper foil on the surface of the mother circuit board 1 opposed to the module 2, a solder resist 122 on the metal part 121, and an organic resin layer 123 such as symbol print in sequence. Then the module 2 is stand-off mounted through the first protrusions 2.
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