| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device and its manufacturing method, comprising a hermetic seal part which enables miniaturized mounting with a simple constitution and can be manufactured accurately at the wafer level. SOLUTION: An epoxy resin sheet 4 having open holes 3 only at photo- detecting parts 2 is adhered through adhesives 5 to a solid-state image sensor element chip 1, and a transparent member 6 to be a flat plate part is adhered onto the epoxy resin sheet 4 through the adhesives 5, thus constituting a solid- state image pickup device.</p> |
