| 摘要 |
PROBLEM TO BE SOLVED: To save an adhesive tape when carrying out dicing in a semiconductor device manufacturing method. SOLUTION: A plurality of semiconductor chips are collectively molded for forming a collective molding 18, the collective molding 18 is put onto an adhesive tape 20 with width that is smaller than an opening part 24 of a dicing frame 22, and at the same time is the same as or slightly larger than the shape of the collective molding, and the dicing is carried out for forming an individual semiconductor package while the collective molding 18 is being put onto the adhesive tape 20. |
