| 摘要 |
PROBLEM TO BE SOLVED: To provide a precise and inexpensive piezoelectric device having structure capable of performing high temperature processing necessary and sufficient for anneal processing regardless of the problem of the thermal resistance of a semiconductor integrated circuit in a piezoelectric device where the semiconductor integrated circuit and a piezoelectric oscillator are incorporated in a package. SOLUTION: In the piezoelectric device where the semiconductor integrated circuit and the piezoelectric oscillator are incorporated in the package, the feature of the piezoelectric device of a surface mount type is that the piezoelectric oscillator is connected to the package with a conductive adhesive, etc., that the semiconductor integrated circuit is arranged at the upper part of the piezoelectric oscillator and that the semiconductor integrated circuit is connected to the electrode pattern of the package with plural bumps. |
