METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a technology for improving a conventional method of manufacturing a multilayer printed wiring board by a conformal mask method of a buildup method using a copper foil with resin, and capable of ensuring reliability in the connection of via holes even when the via holes are reduced in size. SOLUTION: In a method of manufacturing a multilayer printed wiring board by a buildup method, a copper foil 9 of a copper foil 7 with resin is reduced in thickness after applying laser. The method comprises the steps of laminating a copper foil 7 with resin on a core material 5 provided with a bottom land 2 for a via hole by a high-temperature press-forming; forming a conformal mask in which a copper foil 9 at a position responsive to the bottom land 2 is removed by the copper foil 7 with resin; removing the resin 8 by applying laser to form a hole 16 for the via hole; desmearing the inside of the hole 16; plating copper; and patterning.