| 摘要 |
PROBLEM TO BE SOLVED: To prevent the damage of a semiconductor wafer for improving a machining yield, and at the same time to provide the machining device of the semiconductor wafer that can miniaturize facilities. SOLUTION: This machining device of the semiconductor wafer uses mechanical polishing together with dry etching, and thins the semiconductor wafer to target thickness for machining. Also, the machining device is equipped with a polishing part 6 for mechanically polishing the semiconductor wafer, a wafer- washing part 10 for washing the semiconductor wafer after polishing, and plasma treatment parts 4A and 4B for allowing the semiconductor wafer to be subjected to dry etching after washing. In this machining device, wafer- carrying-in and -out parts 9A and 9B are provided in the same device, where the wafer-carrying-in and -out parts compose a wafer-handling means along with a wafer carrier 3 that has the robot mechanism of a polar coordinates system for handling the semiconductor wafer among the parts, thus reducing the number of times for passing the semiconductor wafer for preventing the damage of the semiconductor wafer and at the same time for miniaturizing facilities. |
