| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein thermal conductivity is deteriorated since heat conducting grease is thickened in order to absorb irregularity of height of a CPU when heat of the CPU is transmitted to a heat dissipating plate in the conventional case. SOLUTION: In this heat dissipating structure, proper pressure is applied to a CPU 1 by using a compression spring 9, and a heat dissipating plate is brought into contact with the CPU 1. Furthermore, the CPU 1 is held with fillers 11, 12 in order that position relation between the CPU 1 and the heat dissipating plate may not be changed by dropping and vibrating impact. As a result, a heat dissipating structure of a semiconductor package which structure has high thermal conductivity can be provided.
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