| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein corrosion of an antenna material inside and/or deformation or damage of an antenna coil portion hardly occur. SOLUTION: This semiconductor device is constructed by forming an antenna coil for radio communication electrically connected with a pad portion of an IC chip on the upper surface of an insulating layer formed on the IC chip. An insulating protection layer is formed on the antenna coil. |
