HEAT RESISTANT PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a heat resistant photosensitive resin composition having high sensitivity and superior photosensitive characteristics and giving a good pattern excellent in shape even with low light exposure, to provide a method for producing a pattern by which high sensitivity and superior photosensitive characteristics are ensured and to provide a good pattern excellent in shape is obtained even with low light exposure and electronic parts excellent in reliability by having the pattern. SOLUTION: The heat resistant photosensitive resin composition contains a bissulfonium borate compound and a heat resistant resin. The method for producing a pattern includes a step for forming a film using the photosensitive resin composition, a step for irradiating the film with light through a mask having a prescribed pattern and a step for developing the irradiated film with an organic solvent or a basic aqueous solution. Each of the electronic parts has a pattern obtained by the above method.