| 摘要 |
PROBLEM TO BE SOLVED: To improve the mounting density on a component mounted surface of an electronic circuit board which has a heat sink adhered to the opposite side from the component mounted surface. SOLUTION: A ceramic substrate 2 has electronic components such as a ceramic capacitor 11, an IC 13, and a power IC 14 mounted on its top surface and the heat sink 4 adhered to its reverse surface. The heat sink 4 has suction holes 4a to 4e (passages for suction) in the surface adhered to the ceramic substrate 2. Here, the heat sink 4 is adhered by arranging the ceramic substrate 2 and heat sink opposite each other after applying adhesives 3 which are not hardened to the adhesion surfaces of the both, and then sucking the ceramic substrate 2 to the heat sink 4 through the suction holes 4a to 4e. |
