| 摘要 |
PROBLEM TO BE SOLVED: To guarantee a stress applied to each semiconductor device by confirming the contact state of each input/output terminal of each semiconductor device during a wafer-level burn-in operation. SOLUTION: The operation of an input circuit 3 is changed over by a test terminal 1. A signal which is input from an input terminal 2 is output not to an internal circuit 4 but to an OR circuit 5 or an AND circuit. In the OR circuit 5, the signal of each input terminal is ORed (in the AND circuit, the signal is ANDed). A result is output to one or more output terminals 7 via output circuit 6a. By this constitution, signals are input sequentially (or at a time) to each input terminal, and signals at each output terminal at this time are compared and decided. Thereby, the contact state of each semiconductor device on a wafer during a burn-in operation can be confirmed easily.
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