| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat dissipating structure of an electronic apparatus where a heat dissipating member is fixed to a heat generating component and cooled by means of a fan in which cooling air is supplied positively to not only the heat dissipating member but also the heat generating component. SOLUTION: As shown in Fig 1, a heat dissipating member 2, e.g. a heat sink, is fixed to a heat generating component 1, e.g. a CPU, being mounted on a personal computer and cooled by means of a fan 3. Cooling air from the fan is supplied to not only the heat dissipating member 2 but also the heat generating component 1 and the part of a printed board 4 surrounding the fixing part of the heat generating component in the heat dissipating structure and an electronic apparatus having that structure.
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