| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket which pressurizes a semiconductor device properly at all times and enhance the operability without being affected by an irregularity or the like in the shape or the thickness of the semiconductor device. SOLUTION: The pressurization face of a lid which pressurizes the semiconductor device is constituted of a member which is expanded and contracted by air. The air is injected to the lid from the outside. A pressure is applied to the semiconductor device. The semiconductor device is brought into contact with a conductive sheet.
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