| 摘要 |
PROBLEM TO BE SOLVED: To provide loadlock equipment that is used for a relatively compact substrate treatment device and can efficxiently convey, cool, and/or heat a substrate. SOLUTION: One embodiment relates to a loadlock 30 having a first support structure therein to support one unprocessed substrate, and a second support structure therein to support one processed substrate. The first support structure is located above the second one. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit the insertion of an unprocessed substrate into the loadlock, and the removal of a processed substrate from the loadlock, as well as a second aperture to permit the removal of the unprocessed substrate from the loadlock, and the insertion of the processed substrate into the loadlock. A cooling plate 52 is also located in the loadlock. |
