| 摘要 |
PROBLEM TO BE SOLVED: To obtain a capillary that prevents contact with an adjacent wire in the electrode pad of a fined semiconductor device, and can increase crimping area at a post. SOLUTION: When a post 20 is to be bonded, the setting load of wire bonding is larger than the urging force of a spring 40, thus accommodating a small- diameter part 28 into an accommodation part 24 of a capillary body 22, and allowing a tip 22B of the capillary body 22 to be flush with a tip surface 30 of the small-diameter part 28. At this time, face surface length L2 reaches length obtained by adding the tip 22B of the capillary body 22 to the tip surface 30 of the small-diameter part 28, thus securing a crimping part 54 with nearly the same area as a state where bonding is normally made by the capillary, hence increasing the junction strength of the post 20, and enduring stress that is applied to the post 20 when the semiconductor device is sealed by resin even if the number of pins of the semiconductor device is increased and the size of the package is increased. |
