POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition which satisfies heat resistance, adhesion and low dielectric properties and can form a good image. SOLUTION: The positive type photosensitive resin composition comprises (A) an organic solvent-soluble polyimide having an acid group, (B) a diethyl vinyl ether which imparts low dielectric properties and (C) a photo-acid generating agent. A coating of the photosensitive resin composition is irradiated with UV through a mask and the irradiated part is leached with an aqueous alkali solution to obtain a positive type heat resistant relief.