| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which is excellent in adhesion between a conductor layer including a via hole and a resin insulating layer, and can prevent the delay of signal propagation in a high frequency band, and to provide its manufacturing method. SOLUTION: In a printed wiring board a conductor layer 5 including a via hole 7 and a resin insulating layer 2 covering the conductor layer are made, and an organic compound layer 11 is made at its one part at least of the conductor layer including the via hole. In a method of manufacturing such a printed wiring board, the board where the conductor layer including a via hole is made is soaked in aqueous solution of an organic compound or in organic solvent solution, and an organic compound deposition layer is made on the surface of the conductor layer by soaking method or deposition method, and further a resin insulating layer covering the conductor layer is provided. |
