| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which is excellent in adhesion between a conductor layer including a conductor circuit and a through hole and a resin insulating layer, and can prevent delay of the signal propagation in a high frequency band. SOLUTION: A printed wiring board has a conductor layer 5 and a resin insulating layer covering this conductor layer on a substrate 1, and a through hole for connecting the conductor layers is made on the substrate. An organic compound layer 11 is made at its one part at least of the surface of the through hole or the conductive layer. In a method of manufacturing such a printed wiring board, the board where the conductor layer including a through hole is made is soaked in aqueous solution of an organic compound or in organic solvent solution, and an organic compound layer is made on the surface of the conductor layer. Further, a resin insulating layer covering the conductor layer is provided. |
