| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which is excellent in adhesion between a conductor circuit containing a via hole and a solder-resist layer that covers the former and is capable of preventing propagation delay of signals in a high-frequency band, and a method of manufacturing the same. SOLUTION: This printed wiring board has conductor circuits 9 formed on the substrate 1 and solder-resist layers 18 that cover the respective conductor circuits, and a solder member 21 is formed inside each opening that pierces from the solder-resist layer surface to the conductor circuit. An organic compound layer 11 is formed at least on a part of each conductor layer surface. In the method of manufacturing such a printed wiring board, the substrate on which conductor circuits containing via holes 17 are formed is immersed in an aqueous solution or an organic-solvent solution of the organic compound to form the organic compound layers on the surface of the conductor circuits. After the solder-resist layers that cover the conductor circuits are formed, the solder members are formed inside the openings each piercing from the solder-resist layer surface to the conductor circuit. |
