发明名称 |
HDP-CVD SYSTEM AND GAP-FILLING METHOD USING THE SAME |
摘要 |
PURPOSE: An HDP(High Density Plasma)-CVD(Chemical Vapor Deposition) system and a gap-filling method using the same are provided to prevent the re-deposition of an insulating layer by heating a substrate in a deposition process of the insulating layer. CONSTITUTION: A chilled water pipe is installed at a susceptor(31) in order to protect an aluminium wiring. The first heating portion(31b) is installed within the susceptor(31). The second heating portion(31c) is installed within a wafer chuck(31a). The third heating portion(71a) is installed at a belljar(71) for covering an upper chamber(11a). A remote plasma generator(81) is formed at an outside of the vacuum chamber(11) in order to generate plasma. A plasma transfer tube(91) transfers the generated plasma to the vacuum chamber(11).
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申请公布号 |
KR20010087598(A) |
申请公布日期 |
2001.09.21 |
申请号 |
KR20000011425 |
申请日期 |
2000.03.08 |
申请人 |
JU SUNG ENGINEERING CO., LTD. |
发明人 |
HWANG, CHEOL JU;LEE, YEONG SEOK |
分类号 |
H01L21/205;C23C16/46;C23C16/507;H01L21/316;H01L21/762;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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