发明名称 METHOD OF MANUFACTURING RESISTIVE ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a resistive element which is capable of ensuring enough an electrical connection for an electrode. SOLUTION: An insulator precursor layer 11a containing Si3N4 and a conductor precursor layer 12a containing W are stacked on a board 31, and the laminate is cut into precursor chips 10a corresponding to element forming regions. Then, electrodes slurry containing W is applied in a groove between the precursor chips 10a and dried out into an electrode precursor layer 20a formed on the side of the precursor chip 10a. In succession, sintering-resisting material slurry 33 containing BN or the like is applied on the surface of the electrode precursor layer 20a and dried out into a sintering-resistant material layer 34, and then the precursor chip 10a and electrode precursor layer 20a are baked at the same time. The conductive precursor layer 12a and the electrode precursor layer 20a can be, kept them connected together for sintering without bonding the adjacent electrode precursor layers together.</p>
申请公布号 JP2001257109(A) 申请公布日期 2001.09.21
申请号 JP20000073934 申请日期 2000.03.13
申请人 TDK CORP 发明人 SAWAMURA KENTARO
分类号 H05B3/03;H01C7/00;H01C17/06;H01C17/28;H01C17/30;H05B3/14;H05B3/18;(IPC1-7):H01C17/06 主分类号 H05B3/03
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