SEMICONDUCTOR DEVICE PROVIDED WITH INTEGRATED THERMOELECTRIC COOLER, AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for heat management of an integrated circuit. SOLUTION: A semiconductor device 300 is provided with an integrated circuit and an integrated thermoelectric cooler, formed on a common substrate. The semiconductor device 300 is produced, by forming the integrated circuit on the front of the substrate and forming the integrated thermoelectric cooler on the rear of the substrate. A first heat sink 314, composed of a semiconductor material capable of absorbing heat from the integrated circuit, is formed on a rear surface 306 of the substrate. An n-type thermoelectric element is formed on contracts 348, 350 and 352 which are formed on the first heat sink 314. A p-type thermoelectric element is formed on contacts 348, 350 and 352 formed on a second heat sink composed of semiconductor material, capable of diffusing heat. The p-type and n-type thermoelectric elements are respectively adhered to the contacts on the first and second heat sinks by flip-chip soldering process.