| 摘要 |
<p>PURPOSE: A ring grid array package and a method for manufacturing the same are provided to increase a contact area by forming a cylindrical ring at a contact portion between a package and a substrate. CONSTITUTION: A chip pad(11a) is formed on a semiconductor chip(11). An elastomer(12) is adhered to an upper face of the chip(11) by using a bonding agent. A substrate(13) of a tape shape is adhered to an upper face of the elastomer(12). A multitude of lead pattern(14) is formed on the substrate(12). The lead patterns(14) are connected with the chip pads(11a) of the semiconductor chip(11). A solder mask(15) is adhered to an upper face of the lead pattern(14). A land is formed on the lead pattern(14). A cylindrical ring(16) is adhered to the land. An encapsulant(17) is formed on the whole structure.</p> |
