| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting method of semiconductor devices that can accurately carry out alignment when the semiconductor device is to be mounted onto a substrate. SOLUTION: This mounting method of semiconductor devices has a process that forms an alignment mark 3 in a semiconductor chip 1, a process that forms a through hole 7 for observing the alignment mark 3 of the semiconductor chip 1 at a position corresponding to the alignment mark 3 on a wiring board 4, and a process that observes the alignment mark 3 of the semiconductor chip 1 via the through hole 7 of the wiring board for mounting the semiconductor chip 1 onto the wiring board 4.
|
