发明名称 |
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film |
摘要 |
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
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申请公布号 |
US2001022404(A1) |
申请公布日期 |
2001.09.20 |
申请号 |
US20010842441 |
申请日期 |
2001.04.26 |
申请人 |
HITACHI CHEMICAL COMPANY LTD. |
发明人 |
YAMAMOTO KAZUNORI;SHIMADA YASUSHI;KUMASHIRO YASUSHI;INADA TEIICHI;KURIYA HIROYUKI;KANEDA AIZO;TOMIYAMA TAKEO;NOMURA YOSHIHIRO;HOSOKAWA YOICHI;KIRIHARA HIROSHI;KAGEYAMA AKIRA |
分类号 |
C09J163/00;H01L21/58;H01L23/13;H01L23/31;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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