| 摘要 |
<p>A high power SAW device (10) includes an electrode (16, 19) positioned on a piezoelectric substrate (11). The electrode includes a bonding layer (30) of material deposited on and bonding with the substrate and a conductive structure (35), of at least one layer of material, overlying the bonding layer and fixedly bonded to the substrate by the bonding layer. The conductive structure includes aluminum and an alloy metal with the alloy metal being in a range from approximately 1 % by weight to a percent providing for a favorable trade-off of resistivity versus mechanical properties. The alloy metal is selected from elements in one of the IV and VI columns of the periodic table, e.g. titanium, molybdenum, chromium, and tungsten.</p> |
