| 摘要 |
<p>A process for treating an electronic component (11) wherein the electronic component (11) is exposed to a heated solvent (15) and subsequently to an ozonated process fluid. The electronic component (11) is optionally exposed to the heated solvent (15) by exposing the electronic component (11) to a passing layer of heated solvent. An apparatus for treating electronic component (11) with a heated solvent (15) and ozonated fluid is also provided.</p> |
