| 摘要 |
<p>The invention relates to an electroplating device adapted to plate thin grooves and plugs for wiring in a semiconductor wafer surface, and openings in a resist layer, and adapted to form bumps (projecting electrodes) in a semiconductor wafer surface. The plating device comprises a removable wafer holder for holding a wafer with its ends and backside sealed airtightly and its front surface exposed; a container holding plating solution in which an anode is immersed; a partition arranged between the anode and the wafer held on the wafer holder in the plating bath; circulators for circulating the plating solution in the areas divided by the partition in the plating bath; and a deaerator provided on at least one of the circulators.</p> |
